精品免费人成视频APP_人妻无码一区二区三区四区_国内露脸中年夫妇交换_中文字幕人妻熟人妻熟丝袜美_国产精品久久久久7777按摩_强睡邻居人妻中文字幕_久久精品国产精品亚洲下载_日本不卡一区二区三区_97人人模人人爽人人少妇_看全色黄大色大片免费久久

ICVES'10 Call For Paper

日期：2010-03-02 09:22
Call for Papers
 
2010 IEEE International Conference on Vehicular Electronics and Safety
 
Sponsored by the IEEE Intelligent Transportation Systems Society
Qingdao, China, July 15-17, 2010
 
Venue
ICVES’10 will be held together along with2010 IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applicationsand 2010 IEEE International Conference on Service Operations and Logistics, and Informatics.
                                                                    
The International Conference on Vehicular Electronics and Safety (ICVES’10) is an annual forum sponsored by the IEEE Intelligent Transportation Systems (ITS) Society. It brings together researchers and practitioners to discuss vehicle electronics, and safety systems research and practice. ICVES’10 welcomes papers dealing with any aspect of vehicle electronics and safety systems.
 
OPICS OF INTEREST
? Active and Passive Safety Systems
? Telematics
? Vehicular Power Networks
? X-By Wire Technology
? System-On-a-Chip
? Vehicular Sensor
? Vehicle Bus
? Sensor Network
? Embedded Operation System
? Electro Magnetic Compatibility
? Inter-Vehicular Network
? Vehicle Testing
? Vehicle Hardware /Software System
 
? Navigation and Localization Systems
? Vehicular Measurement Technology
? Vehicular Signal Processing
? Micro-electromechanical Systems
? Image Sensor
? Vehicle/Engine Control
? Driver Assistance Driving Systems
? Adaptive Cruise Control Systems
? Pattern Recognition for Vehicles
? Human Machine Interaction
? Diagnostics on Line
? Virtual/Digital System
 
PAPER SUBMISSION
 
Complete manuscripts in PDF must be electronically submitted at the conference website: http://www.ieeeves.org .  Manuscripts should be at most six (6) pages in the IEEE two-column format including figures, tables, and references.
 
Please refer to the conference website for the most up-to-date information:
 
 
 Attachment: CALL FOR PAPER